Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure
Article
Article
Abstract The thermo-mechanical reliability of IMCs (Ni3Sn4, Cu3Sn, Cu6Sn5) solder joints and Sn-3.9Ag-0.6Cu solder joints was investigated systematically in 3D chip stacking structure subjected to an accelerated thermal ...
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