Recovery of copper ions from acidic cleaning wastewater of printed circuit board using a hybrid membrane-electrodeposition process
HU Wanda · Editorial Office of Industrial Water Treatment · 2026
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APA 7
Wanda, H. (2026). Recovery of copper ions from acidic cleaning wastewater of printed circuit board using a hybrid membrane-electrodeposition process. https://doi.org/10.19965/j.cnki.iwt.2025-0489
MLA
Wanda, HU. "Recovery of copper ions from acidic cleaning wastewater of printed circuit board using a hybrid membrane-electrodeposition process." 2026. https://doi.org/10.19965/j.cnki.iwt.2025-0489.
Chicago
Wanda, HU. 2026. "Recovery of copper ions from acidic cleaning wastewater of printed circuit board using a hybrid membrane-electrodeposition process.". https://doi.org/10.19965/j.cnki.iwt.2025-0489.
Harvard
Wanda, H. 2026, Recovery of copper ions from acidic cleaning wastewater of printed circuit board using a hybrid membrane-electrodeposition process, Editorial Office of Industrial Water Treatment, available at: https://doi.org/10.19965/j.cnki.iwt.2025-0489 [Accessed 9 Aug. 2026].
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- Titolo
- Recovery of copper ions from acidic cleaning wastewater of printed circuit board using a hybrid membrane-electrodeposition process
- Autore / collaboratori
- HU Wanda
- Editore
- Editorial Office of Industrial Water Treatment
- Anno di pubblicazione
- 2026
- ISSN
- 1005-829X
- ISSN
- 1005-829X
- Lingua
- zho
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