Dynamic mechanical and spectroscopic studies of soy flour adhesives

We used dynamic mechanical analysis (DMA) to evaluate soy flour adhesives made with and without a conventional crosslinking agent, polyamideamine-epichlorohydrin (PAE). Fixed-frequency and constant strain rate studies revealed that PAE contributes to a decrease in glass transition temperature (Tg), an increase in toughness, and a decrease in both the rubbery plateau modulus and onset temperature, consistent with plasticization. Fourier transform infrared spectroscopy (FTIR) and nuclear magnetic resonance (NMR) studies of water-soluble extracts from pre-cured soy flour revealed the presence of polypeptides with exchangeable protons, carbohydrates, citric acid and lactic acid. Deuterium exchange studies showed that the protonated peptides were no longer water-soluble after cure. Instead, post-cure extracts contained heat-modified carbohydrates and carboxylic acids, together with adipic acid when PAE was employed. These results are consistent with a mechanism whereby PAE not only undergoes hydrolysis and chain scission, but also competitively co-reacts with peptides and carboxylic acids to yield a plasticized chain-extended network with decreased crosslink density, counter to its anticipated function. The implications of these findings as they pertain to moisture resistance and wood adhesion will be discussed.