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Subdimensions of Technostress Across Industries: A Systematic Review

Jogtika Ramasamy et al · MMU Press · 2026

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Technostress is the stress induced by the use of digital technologies, which has attracted growing academic interest due to its multidimensional nature and impact across various industries. In this light, the aim of this systematic review was to analyse the most frequently reported sub-dimensions of the technostress creator's framework, identify the issues related to the dimensions of technostress and to evaluate how technostress is conceptualised as a unidimensional or multidimensional construct. Based on Scopus as the single database, 52 empirical papers were retrieved that have been published from 2020 to 2025 mid and were subject to a structured dimension-mapping approach. These findings highlight five core sub-dimensions of technostress creators consistently reported in the literature (techno-overload, techno-complexity, techno-invasion, techno-insecurity, and techno-uncertainty) and the emergence of new emotions such as techno-anxiety, fatigue and addiction. Both dimensions imply different psychological and organisational challenges, confirming the necessity for stress-specific intervention programs. Approximately 36 out of 52 of the reviewed studies adopted a multidimensional approach, indicating a methodological trend towards a more detailed measurement on technostress. This review underscores the lack of terminological uniformity between studies and suggests that future research should establish common frameworks, investigate context-specific stressors, and evaluate selective interventions. The expected outcome is to provide insights into how technostress is conceptualised and measured across industries, highlighting the most common dimensions, emerging constructs, and the shift from unidimensional to multidimensional perspectives.

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APA 7

al, J. R. E. (2026). Subdimensions of Technostress Across Industries: A Systematic Review. https://doi.org/10.33093/ijomfa.2026.7.1.18

MLA

al, Jogtika Ramasamy et. "Subdimensions of Technostress Across Industries: A Systematic Review." 2026. https://doi.org/10.33093/ijomfa.2026.7.1.18.

Chicago

al, Jogtika Ramasamy et. 2026. "Subdimensions of Technostress Across Industries: A Systematic Review.". https://doi.org/10.33093/ijomfa.2026.7.1.18.

Harvard

al, J. R. E. 2026, Subdimensions of Technostress Across Industries: A Systematic Review, MMU Press, available at: https://doi.org/10.33093/ijomfa.2026.7.1.18 [Accessed 29 Jun. 2026].

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Título
Subdimensions of Technostress Across Industries: A Systematic Review
Autor / colaboradores
Jogtika Ramasamy et al
Editorial
MMU Press
Año de publicación
2026
ISSN
2735-1009
ISSN
2735-1009
Idioma
eng

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