Thermal Phase Sensitivity Reduction in Hollow-Core Photonic Bandgap Fibers Enabled by a Stress-Buffering Coating Architecture
Jirong Wang et al · IEEE · 2026
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APA 7
al, J. W. E. (2026). Thermal Phase Sensitivity Reduction in Hollow-Core Photonic Bandgap Fibers Enabled by a Stress-Buffering Coating Architecture. https://doi.org/10.1109/JPHOT.2026.3683877
MLA
al, Jirong Wang et. "Thermal Phase Sensitivity Reduction in Hollow-Core Photonic Bandgap Fibers Enabled by a Stress-Buffering Coating Architecture." 2026. https://doi.org/10.1109/JPHOT.2026.3683877.
Chicago
al, Jirong Wang et. 2026. "Thermal Phase Sensitivity Reduction in Hollow-Core Photonic Bandgap Fibers Enabled by a Stress-Buffering Coating Architecture.". https://doi.org/10.1109/JPHOT.2026.3683877.
Harvard
al, J. W. E. 2026, Thermal Phase Sensitivity Reduction in Hollow-Core Photonic Bandgap Fibers Enabled by a Stress-Buffering Coating Architecture, IEEE, available at: https://doi.org/10.1109/JPHOT.2026.3683877 [Accessed 8 Aug. 2026].
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- Titolo
- Thermal Phase Sensitivity Reduction in Hollow-Core Photonic Bandgap Fibers Enabled by a Stress-Buffering Coating Architecture
- Autore / collaboratori
- Jirong Wang et al
- Editore
- IEEE
- Anno di pubblicazione
- 2026
- ISSN
- 1943-0655
- ISSN
- 1943-0655
- Lingua
- Inglés
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