The Influence of Physical Fields on the Thermal or Dielectric Properties of Epoxy Composites

<p>The latest developments in the field of materials to improve the physical and chemical properties is the use of physical modification of polymeric materials. The specimens of polyepoxy and composites on the base metal oxides CdO, PbO, Cr2O3 have been studied by methods of thermal and dielectric analysis. Blending physical fields during curing samples stimulates reduction of activation energy, but also contributes to the glass transition temperature and confirms the conclusion set conformational change in the interstitial fragments forming a grid Chemical oxirane polymers under the influence of external physical fields. Differences tanhesa dielectric loss determined topological structure changes due to the influence of external factors on the reaction polipryyednannya and forming a three-dimensional grid. Blending physical fields during curing samples stimulates reduction of activation energy, but also contributes to the glass transition temperature and confirms the conclusion set conformational change in the interstitial fragments forming a grid Chemical oxirane polymers under the influence of external physical fields. Differences tangents dielectric loss determined topological structure changes due to the influence of external factors on the reaction polyaddition and forming a threedimensional grid.</p><p><strong>Key words:</strong> physical fields, polyepoxy, mesocomposites, metal oxide.</p>