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Eco-friendly Grinding: A Bibliometric and Knowledge Map Analysis

Hao Wu et al · KeAi Communications Co., Ltd · 2025

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Abstract As the manufacturing industry shifts toward environmentally sustainable practices, grinding—a high-precision processing method—is commonly used to ensure final workpiece dimensions and surface quality. The greening of grinding processes has emerged as an important challenge for both academia and industry. Numerous studies proposing different methods for sustainable grinding have increased rapidly; however, the technical mechanisms and development trends remain unclear. This paper applies bibliometric methods to analyze relevant articles published on WOS from 2008 to 2023. Results show that China has the highest number of publications (45.38%), with research institutions primarily located in China, India, and Brazil. Among publishing journals, 70% are classified as Q2 or above. Additionally, popular authors and influential articles in this field are identified. Keyword frequency and hotspot literature analysis reveal that research focuses primarily on minimal quantity lubrication (MQL) grinding, especially using biolubricants and nanoparticles to improve grinding performance. This article reviews the mechanisms and effects of biolubricants and nanoparticles in MQL. It further examines how multi-energy field applications enhance MQL by influencing droplet atomization, wettability, and machining performance. A low-temperature field improves the heat exchange capacity of MQL droplets, while an electrostatic field enhances droplet contact angles and dispersion. Ultrasonic energy enhances the atomization of biolubricants, and magnetic fields facilitate nanoparticle penetration into the grinding zone, reducing grinding forces. Additionally, innovations in grinding wheel structures and solid lubrication grinding can reduce grinding temperatures and forces. This paper presents a comprehensive review of eco-friendly grinding development hotspots, providing technical support and theoretical guidance for academia and industry.

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APA 7

al, H. W. E. (2025). Eco-friendly Grinding: A Bibliometric and Knowledge Map Analysis. https://doi.org/10.1186/s10033-025-01198-7

MLA

al, Hao Wu et. "Eco-friendly Grinding: A Bibliometric and Knowledge Map Analysis." 2025. https://doi.org/10.1186/s10033-025-01198-7.

Chicago

al, Hao Wu et. 2025. "Eco-friendly Grinding: A Bibliometric and Knowledge Map Analysis.". https://doi.org/10.1186/s10033-025-01198-7.

Harvard

al, H. W. E. 2025, Eco-friendly Grinding: A Bibliometric and Knowledge Map Analysis, KeAi Communications Co, Ltd, available at: https://doi.org/10.1186/s10033-025-01198-7 [Accessed 9 Aug. 2026].

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Titolo
Eco-friendly Grinding: A Bibliometric and Knowledge Map Analysis
Autore / collaboratori
Hao Wu et al
Editore
KeAi Communications Co., Ltd
Anno di pubblicazione
2025
ISSN
2192-8258
ISSN
2192-8258
Lingua
Inglés

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