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Prospects for the development of thin-film microassemblies

V. G. Spirin · Politekhperiodika · 2005

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Author / responsible party
V. G. Spirin
Publisher
Politekhperiodika
Year
2005
ISSN
3083-6530
ISSN
3083-6530
Language
English

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Summary

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Based on the analysis of certain structural and technological options, the prospects for increasing the integration of thin-film microassemblies with substrates made of sitall, polycor, sapphire, and silicon are considered. The technology for manufacturing chromium resistors on silicon is described. An assessment of the packing density of printed and silicon boards is provided.

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APA 7

Spirin, V. G. (2005). Prospects for the development of thin-film microassemblies. https://nodovox.com/record.php?id=299884

MLA

Spirin, V. G. "Prospects for the development of thin-film microassemblies." 2005. https://nodovox.com/record.php?id=299884.

Chicago

Spirin, V. G. 2005. "Prospects for the development of thin-film microassemblies.". https://nodovox.com/record.php?id=299884.

Harvard

Spirin, V. G. 2005, Prospects for the development of thin-film microassemblies, Politekhperiodika, available at: https://nodovox.com/record.php?id=299884 [Accessed 9 Aug. 2026].

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Resource details

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Title
Prospects for the development of thin-film microassemblies
Author / contributors
V. G. Spirin
Publisher
Politekhperiodika
Publication year
2005
ISSN
3083-6530
ISSN
3083-6530
Language
English

Subjects

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thin-film microassembly; substrate; silicon resistors; packing density; design standards
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