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A technique to package Fiber Bragg Grating Sensors for Strain and Temperature Measurements

Uilian Dreyer et al · Sociedade Brasileira de Microondas e Optoeletrônica e Sociedade Brasileira de Eletromagnetismo

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This paper reports an effective method of packaging a fiber Bragg grating (FBG) for the simultaneous measurement of temperature and strain. The technique consists of embedding two fiber Bragg grating sensors inside a polymeric material with different geometrical characteristics. The mechanical and thermal characterizations of the optical transducer were performed. Then a matrix equation used measurements of the wavelength shifts from the two sensors and yielded information about the temperature and strain coefficients. The preliminary results demonstrate the feasibility of the encapsulation technique allowing measurements of temperature and strain in smart structures and harsh environments. The experimental procedure provides robustness to the sensor and the matrix equation approach has the potential to determine simultaneously the strain and temperature coefficients.

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APA 7

al, U. D. E. (s. f.). A technique to package Fiber Bragg Grating Sensors for Strain and Temperature Measurements. https://doi.org/10.1590/S2179-10742013000200031

MLA

al, Uilian Dreyer et. "A technique to package Fiber Bragg Grating Sensors for Strain and Temperature Measurements.". https://doi.org/10.1590/S2179-10742013000200031.

Chicago

al, Uilian Dreyer et. s. f. "A technique to package Fiber Bragg Grating Sensors for Strain and Temperature Measurements.". https://doi.org/10.1590/S2179-10742013000200031.

Harvard

al, U. D. E. s. f, A technique to package Fiber Bragg Grating Sensors for Strain and Temperature Measurements, Sociedade Brasileira de Microondas e Optoeletrônica e Sociedade Brasileira de Eletromagnetismo, available at: https://doi.org/10.1590/S2179-10742013000200031 [Accessed 9 Aug. 2026].

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Title
A technique to package Fiber Bragg Grating Sensors for Strain and Temperature Measurements
Author / contributors
Uilian Dreyer et al
Publisher
Sociedade Brasileira de Microondas e Optoeletrônica e Sociedade Brasileira de Eletromagnetismo
ISSN
2179-1074
ISSN
2179-1074
Language
English

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