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Thermal properties of Sn-based solder alloys

Morando, Carina Noemi et al · Springer · 2014

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Author / responsible party
Morando, Carina Noemi et al
Publisher
Springer
Year
2014
ISSN
3440-3447
ISSN
3440-3447
Language
English

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During last few decades, emerging environmental regulations worldwide, more notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies due to the inherent toxicity of this element.This situation drives to the replacement of the SnPb solder alloy of eutectic composition commonly used as joining material to suitable lead-free solders for microelectronic assembly. Sn-based alloys containing Ag, Cu, Bi, and Zn are potential lead-free solders, usually close to the binary or ternary eutectic composition. For this reason a great effort was directed to establish reliable thermophysical data fundamental to interpret the solidification process and fluidity of alloys belonging to these systems. In this work, an analysis of the solidification process of pure Sn, binary SnAg, SnCu, SnBi, SnZn, SnPb and ternary SnAgCu eutectic alloys was carried out using computer aided-cooling curve analysis and differential scanning calorimetry. Fil: Morando, Carina Noemi. Universidad Nacional del Centro de la Provincia de Buenos Aires. Facultad de Ciencias Exactas. Instituto de Física de Materiales; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Tandil. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires; Argentina Fil: Fornaro, Osvaldo. Universidad Nacional del Centro de la Provincia de Buenos Aires. Facultad de Ciencias Exactas. Instituto de Física de Materiales; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Tandil. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires; Argentina

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APA 7

Morando, C. N. E. A. (2014). Thermal properties of Sn-based solder alloys. http://hdl.handle.net/11336/4596

MLA

Morando, Carina Noemi et al. "Thermal properties of Sn-based solder alloys." 2014. http://hdl.handle.net/11336/4596.

Chicago

Morando, Carina Noemi et al. 2014. "Thermal properties of Sn-based solder alloys.". http://hdl.handle.net/11336/4596.

Harvard

Morando, C. N. E. A. 2014, Thermal properties of Sn-based solder alloys, Springer, available at: http://hdl.handle.net/11336/4596 [Accessed 8 Aug. 2026].

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Title
Thermal properties of Sn-based solder alloys
Author / contributors
Morando, Carina Noemi et al
Publisher
Springer
Publication year
2014
ISSN
3440-3447
ISSN
3440-3447
Language
English

Subjects

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Sn-Based Alloys; Lead-Free Solders; Differential Scanning Calorimetry; Computer Aided-Cooling Curve Analysis; https://purl.org/becyt/ford/1.3; https://purl.org/becyt/ford/1
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