Defining the zerogap: cracking along the photolithographically defined Au–Cu–Au lines with sub-nanometer precision

Cracks are formed along the photolithographically pre-determined lines with extremely high yield and repeatability, when Cu clusters are introduced between planarized Au thin films sequentially deposited on a PET substrate. These clusters act as nanometer-sized spacers preventing the formation of contiguous metallic bond between the adjacent Au layers which will render prepatterned-cracking impossible. While the effective gap width is initially zero in the optical sense from microwaves all the way to the visible, outer-bending the PET substrate allows the gap width tuning into the 100 nm range, with the stability and controllability in the ranges of 100 s and Angstrom-scale, respectively. It is anticipated that our wafer-scale prepatterned crack technology with an unprecedented mixture of macroscopic length and Angstrom-scale controllability will open-up many applications in optoelectronics, quantum photonics and photocatalysis.