Mechanical Properties Optimization and Microstructure Analysis of Pure Copper Heterostructured Laminates via Rolling
Zhihui Gao et al · KeAi Communications Co., Ltd · 2024
Resource access
Open the content from the main option or choose another available source.
Open access available
Summary
Descripción general del contenido del recurso.
How to cite
Elegí el formato que necesitás y copiá la referencia al portapapeles.
APA 7
al, Z. G. E. (2024). Mechanical Properties Optimization and Microstructure Analysis of Pure Copper Heterostructured Laminates via Rolling. https://doi.org/10.1186/s10033-024-01102-9
MLA
al, Zhihui Gao et. "Mechanical Properties Optimization and Microstructure Analysis of Pure Copper Heterostructured Laminates via Rolling." 2024. https://doi.org/10.1186/s10033-024-01102-9.
Chicago
al, Zhihui Gao et. 2024. "Mechanical Properties Optimization and Microstructure Analysis of Pure Copper Heterostructured Laminates via Rolling.". https://doi.org/10.1186/s10033-024-01102-9.
Harvard
al, Z. G. E. 2024, Mechanical Properties Optimization and Microstructure Analysis of Pure Copper Heterostructured Laminates via Rolling, KeAi Communications Co, Ltd, available at: https://doi.org/10.1186/s10033-024-01102-9 [Accessed 8 Aug. 2026].
Resource details
Bibliographic information to help confirm that this is the correct material.
- Title
- Mechanical Properties Optimization and Microstructure Analysis of Pure Copper Heterostructured Laminates via Rolling
- Author / contributors
- Zhihui Gao et al
- Publisher
- KeAi Communications Co., Ltd
- Publication year
- 2024
- ISSN
- 2192-8258
- ISSN
- 2192-8258
- Language
- English
Subjects
Explore related resources through these subjects.